The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. The Evolution of Cool! High-Density ceramic content: Céramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer. This exclusive combination provides performance exceeding most metal based compounds.